Shin-Etsu X23 Thermal Compound (Model X23-7783D) – This thermal interface compound is developed by Shin Etsu Chemical Co., Ltd. to meet the current and future requirements of high performance microprocessors. Shin-Etsu MicroSi’s X23-7783D product offering utilizes fillers that have a controlled diameter. The smaller diameter filler allows the material to achieve thinner bondlines. For best results, this material should be used in applications where the hills and valleys of the mating surfaces are minimal.
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