The Feser Company (TFC) is one of the specialists among the manufacturers of water cooling and is expanding its offerings in this area. In the wake of this development is a separate thermal compound in the name of H-Bridge.
The layer between the cooler and the heat source should never be forgotten. Both surfaces look flat , but microscopic valleys are always present and thus never 100% contact is impossible to achieve. A thermal compound fills gaps and allows a transfer of heat over the entire surface.
With a thermal conductivity of 9.24 W / m C is a remarkable performer. The thermal paste is suitable for all types of coolers suitable: CPU, GPU, Chipset, voltage transformers, etc. The compound is suitable over a temperature range of -30 to +200 C guaranteed. With 5g, the amount per tube is plenty for many applications.
Note: This Item can not be shipped using DHL
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