Coollaboratory MetalPad (100% Liquid Metal) Thermal Interface Material – CPU – 1 Pads

The Coollaboratory Liquid MetalPad Thermal Interface Pad is the first heat conduction pad composed of 100% metal and melts with heat from the processor (Burn In-process), and then it performs superior heat transfer. It dissipates the heat fast and efficiently, outperforming the best heat conduction pastes. The simple, clean and fast installation turns the Liquid MetalPad into the ultimate heat conduction medium for High End PCs.

The Liquid MetalPad can be used with all on the cooling market commercially available materials, for instance aluminum or copper! It doesnt age and doesnt have to be exchanged regularly. The Coollaboratory Liquid MetalPad is RoHS compatible and absolute nontoxic.

The Coollaboratory Liquid MetalPad is delivered in a transparent blister-package and contains one Liquid MetalPads. Additionally there is a detailed printed manual included.

Note: This Item can not be shipped using DHL