AMD’s Zen architecture was a milestone in the history of CPU architecture and a stroke of genius by the Texas based chipmaker. Instead of resting on its laurels, AMD has been busy improving the Zen processors. The result is the new Ryzen 3000 processor family based on the Zen2 architecture with its chiplet design. The Ryzen 9 3900X for example consists of a 12-nm I/O die and two CPU dies manufactured in a 7-nm process.

This chip design however has also changed the layout of the CPU dies on the package, which has also shifted the thermal center point. On a processor with only one CPU die under the heatspreader, the hot spot is in the middle of the CPU. Due to the new chip design, the hot spot has moved to the edge of the heatspreader.

This has an influence on the cooling behavior of CPU coolers. Especially AiOs (All in One watercoolers) – or CLCs (Closed Liquid Coolers) – with a round cooling block often do not completely cover the corners of the heatspreader. For an optimal cooling performance, the base plate of the AiO would have to be shifted around.

This is where professional overclocker Roman Hartung comes into play. Using his der8auer RYZEN 3000 OC Bracket Custom Mount the base plate of an AIO can be flexibly positioned on the heatspreader.

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