Details

EK-Loop Thermal Paste NGP (5g) is a reliable thermal compound, optimized for demanding computing environments. Utilizing advanced Nano Grade Particle (NGP) technology, this thermal paste facilitates efficient heat transfer between CPUs, GPUs, or any other chipsets and their cooling solutions, including water blocks and heatsinks.

Engineered for efficiency and reliability, the EK-Loop Thermal Paste NGP features very low thermal impedance, ensuring effective heat conductivity and enhanced system performance. Its optimized formula offers excellent crumpling resistance and long-term stability, performing consistently within a temperature range of -20 C to 125 C.

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