Fujipoly SARCON G-M Thermal Padding – Mosfet Block Size Sheet – 100 x 15 x 0.5 mm

SARCON Thermal Gap Filler Pads are highly conformable and high heat conducting gel materials in a versatile sheet form. They easily fit and adhere to most all shapes and sizes of components, including protrusions and recessed areas.

In areas where space between surfaces is uneven or varies and where surface textures are a concern regarding efficient thermal transfer, the supple consistency of the pads is excellent for filling air gaps and uneven surfaces.

Sarcon GR-m is a highly conformable,thermally conductive 6.0watt/m-k (No electricity conductive) in areas where space between surfaces are uneven and surface textures vary. Sarcon GR-m material conforms to irregular surfaces and fills air gaps.

This is a single 100 x 15mm piece that would commonly be used for Mosfet blocks and sinks.

Applications:

• Between a chassis wall and other surface.
• Between a ?CPU ? and heat sinks.
• Between a semiconductors and heat sinks.
• Areas where heat needs to be transferred to some type of heat spreader.