JP-T180 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure.
JP-T180 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity.
So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full.
Heat effect increased significantly.
JP-T180 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.
Applications:
- Electronic components: IC, CPU, MOS, LED, M/B, P/S, HEAT SINK, LCD-TV, N/B PC, PC, Telecom Device, Wireless Hub etc.
- DDR II Module, DVD Applications, Hand-set applications etc
10mm Wide and Tape sold by the foot .
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