Laird Tflex 700 Series – Best Thermal Silicone Pad 5.0 W/m-K

Laird Tflex 700 Series – Best Thermal Silicone Pad 5.0 W/m-K

This item is sold and priced per piece – 16mm x 15mm x 1.5mm

This is the original Tflex 760 high performance thermal silicone pad for CPU/GPU/RAM chipset in notebook, desktop, and laptop computers in Apple and IBM computers.

5 W/mK soft gap filler thermal interface material from Laird Thermal

Laird Thermal’s Tflex ? 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component topography, resulting in little or no stress on the components and mating chassis or parts. Tflex 700 ?s unique silicone and ceramic filler technology allows a combination of high compliancy and high thermal performance. Tflex 700 is naturally tacky and requires no additional adhesive coating to inhibit thermal performance. Tflex 700 is electrically insulating and stable from -45C thru 200C. It also meets UL 94V0 flame rating.